By Wen-Yee Lee TAIPEI, May 29 (Reuters) - Taiwan chip designer MediaTek said on Friday it supports both TSMC's and Intel's ...

MediaTek is using Intel's EMIB packaging alongside TSMC's CoWoS for AI ASIC designs, targeting 26% of the AI ASIC market by 2028 amid capacity constraints.

Siegwerk has introduced Cirkit Novaseal, a dedicated line of heat-seal lacquers under its Cirkit coatings range. The line is ...

ASE Technology Holding Co., Ltd. ASX is benefiting from a favorable semiconductor industry backdrop, driven by surging artificial intelligence (AI) adoption, growing high-performance computing (HPC) ...

TSMC has spent years guarding its most advanced chip packaging technology, building out capacity internally and keeping the ...

ASE Technology is positioned for robust growth, driven by its LEAP segment amid surging AI and data center demand. Read more on ASX stock here.

USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions.

New venture arm to invest in and scale companies driving the next generation of packaging and reimagining how products move ...

Plastipak Packaging Inc., headquartered in Plymouth, Michigan, has announced its Direct Object Printing (DOP) patented technology has earned a 2017 Silver Award for Packaging Innovation from DuPont ...

WEST LAFAYETTE, Ind. – A large-scale manufacturing process to improve food packaging and keep groceries fresher longer has received top honors at one of the world’s largest technical conferences for ...

Gain Real-World Experience: Two blocks of cooperative education provide you with hands-on, full-time paid work experience in the packaging science industry ...