The Next Computing Revolution May Come From Stacking Chips Like Skyscrapers

Researchers may have unlocked the future of computing by turning flat silicon chips into densely stacked 3D architectures.

Twisted stacking lets 2D conductor keep single-layer performance in bulk form

Two-dimensional (2D) materials, which are significantly thinner than a single sheet of paper, have long drawn attention for ...
AlphaGalileo

KAIST Resolves Long-standing Challenge of Performance Degradation in Stacked 2D Materials

KAIST researchers develop a next-generation 2D conductive material that maintains single-layer electronic properties even ...

'All-in-one' platform developed for multiple trait stacking in crops

A major goal of modern crop breeding is to efficiently combine multiple desirable traits by "stacking" the favorable gene ...

Microsoft bets on AI agents, not apps, and dynamic UI with Project Solara

Project Solara rethinks computing with AI agents replacing apps, dynamic interfaces adapting in real time, and hardware ...
IEEE

Single-mode 48-channel 1060 nm Metal-Aperture VCSEL Array Enabling 9.6 Tbps Data Throughput

Abstract: We demonstrate a 48-channel 1060-nm single-mode VCSEL array with metal-aperture coupled cavities, achieving >45 GHz bandwidth. Large-signal PAM4 modulation yields open eyes at 200 Gbps with ...